ABSTRACT
In this talk we will give at first a broad overview of the research and academic activities in the fields of electrical engineering, and computer science developed in the framework of the Université Grenoble Alpes and Grenoble Institute of Technology.
Afterwards, we will present the different research topics investigated in TIMA Laboratory. The themes cover the specification, design, verification, test, CAD tools and design methods for integrated systems, from analog and digital components on one end of the spectrum, to multiprocessor Systems-on-Chip together with their basic operating system on the other end.
Finally, we will focus on the recent developments of the CDSI group and in particular on Micro and Nano Systems activities. A particular attention will be paid to the presentation of new micro generators for autonomous sensors, and of MEMS for acoustic and haptic applications.

BIOGRAPHY
Skandar Basrour graduated from the Ecole Normale Supérieure, Tunisia, in 1986, and received the Ph.D. degree in microelectronics from the Université Joseph Fourier (UJF), Grenoble, France, in 1990. From 1992 to 2001, he was an assistant professor in electronics and microsystems at the Université de Franche-Comté, Besancon, France. He contributed to the development and the improvement of 3D microfabrication techniques (X-ray and UV LIGA). Since 2001, he is a professor in electronics and microsystems at the Electrical Department of Polytech Grenoble, UJF. Since 2002, he is the leader of the Micro Engineering and Nano Systems (MNS) group within the TIMA laboratory. His research activities involve the design, fabrication, and characterization of integrated MEMS, NEMS, and micropower sources. Since 2010, parts of his research activities are utilized in two start-up. Since 2015, he is the deputy director of TIMA Lab.

ABSTRACT
The microelectronics technology and subsequent miniaturization have improved our lives through revolutionized computing, communication. The exponential rate of advancement based on Moore’s Law has been propelled by $1Tr of investment over 50 years. Recent advances in the field, pursued through More than Moore technology, are propelled by applications such as wearable systems, health monitoring, displays, and biomedical applications etc. Many of these applications require electronics to be present over large areas and to conform to 3D surfaces and this calls for new methods to realize electronics on unconventional substrates such as plastics. The sensitive electronics systems on large areas (larger than the traditional wafers) and possibly stretchable substrates will open avenues for new advances such as robots with conformable electronic skin.
This talk will present various approaches (over different time and dimensional scales) for obtaining distributed electronics and sensors on flexible and conformable substrates, especially in context with tactile or electronics skin. The lecture will begin with recent developments such as using off-the-shelf sensors and electronic components on flexible printed circuit boards to obtain large area tactile skin for robots and wearable systems. This will be followed by various other alternatives being explored today (e.g. printing of nanowires, and ultra-thin chips, etc.) and the potential challenges and success on various time scales. The lecture will conclude with a discussion on how the field and associated technologies may evolve in the future with new emerging applications such as internet of things, smart cities and mobile health.

BIOGRAPHY
Dr. Ravinder Dahiya is Reader and EPSRC (Engineering and Physical Science Research Council) Fellow in the School of Engineering at University of Glasgow, UK. He is the leader of Bendable Electronics and Sensing Technologies (BEST) group, which conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems.
His multidisciplinary research interests include Flexible and Printable Electronics, Electronic Skin, Robotic Tactile Sensing, and Wearable Electronics. He has published more than 130 research articles, 6 book (5 at various publication stages) and 9 patents (including 7 submitted). He has led many international projects funded by many agencies including European Commission, EPSRC, The Royal Society and The Royal Academy of Engineering.
He is the Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of IEEE Transactions on Robotics and IEEE Sensors Journal. He has been guest editor of 4 Special Journal Issues. He represents IEEE Robotics and Automation Society in the Administrative Committee (AdCom) of IEEE Sensors Council. He was General Chair of IEEE PRIME 2015 and is the Technical Program Chair (TPC) for 2017 IEEE Sensors Conference. He is the founding chair of the UKRI section chapter of IEEE Sensor Council.
Dr. Dahiya holds prestigious EPSRC Fellowship. In past he received Marie Curie Fellowship and Japanese Monbusho Fellowship. He was awarded with the University Gold Medal and received 2 best paper awards and 2 second best paper awards (as co-author) IEEE international conferences.

ABSTRACT
ECSEL is the largest Public-Private Partnership in Horizon2020 and with around 2.4BEuro it is the largest funding program in the ICT domain. It builds on the previous ENIAC and ARTEMIS Joint Technology Initiatives of FP7, and is characterised by the joint funding by the Commission and the Member States, and the possibility to cover also large projects. However, after a promising start with the previous ENIAC and ARTEMIS JU the Italian contribution has been decreasing, and Italian bureaucracy is giving an hard time to Universities and SME’s. The ECSEL Mirror Group Italy brings together Italian partners of the three European Technology Platforms participating in the ECSEL Joint Undertaking: AENEAS, ARTEMISIA and EPOSS, with the goal to involve central and regional funding authorities in the support of the ECSEL initiative and to promote the Italian participation to project proposals, with special attention to SMEs.

BIOGRAPHY
Livio Baldi graduated in Electronic Engineering in 1973 at the University of Pavia. In 1974 he joined SGS-ATES (now STMicroelectronics), where he was responsible for the development of CMOS processes with embedded NVM, for their Design Platform, and afterwards for the participation of ST Italy in research projects under EUREKA and Framework Programmes. He moved to Numonyx and to Micron in the same role, following the spin-off of memory activities by STMicroelectronics. He participated in setting up the JESSI initiative, and the ENIAC ETP and is member of the AENEAS Support Group, as permanent guest. Currently retired, he is acting as consultant for European funded projects on behalf of two Italian semiconductor companies. He is industrial co-leader of the NEREID Support Action of H2020. He holds 34 US Patents and 28 European patents.